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Electrochemical Etching on Copper Surfaces to Achieve Superhydrophobicity
In the present study, an attempt has been made to create superhydrophobicity on copper substrate by etching the surface at different parameters (current density and time). Etching time was varied from 30 to 240 minutes. Untreated copper surface exhibited contact angle of 91.4°. The best etched surface exhibited a maximum contact angle of 142.1° for a current density of 0.01A/cm2 and etching time of 60 minutes. The structure–property relationship of etched copper surface has been discussed by interpreting atomic force microscope results with contact angle.
Copper plate; Etching; Surface roughness; Contact angle; Super hydrophobic surfaces
Koushik N., Jameson Keisham, Avinash Poojary, Lathesh, Shankarappa Kalgudi, Pavithra G.P., Satyanarayan. Electrochemical Etching on Copper Surfaces to Achieve Superhydrophobicity. International Journal of Manufacturing and Materials Processing. 2019; 5(1): 27-31p.
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