Electrochemical Etching on Copper Surfaces to Achieve Superhydrophobicity

Authors

  • Koushik N. Department of Mechanical Engineering, Alva’s Institute of Engineering & Technology, Moodbidri, Karnataka, India
  • Jameson Keisham Department of Mechanical Engineering, Alva’s Institute of Engineering & Technology, Moodbidri, Karnataka,
  • Avinash Poojary Department of Mechanical Engineering, Alva’s Institute of Engineering & Technology, Moodbidri, Karnataka,
  • Lathesh , Department of Mechanical Engineering, Alva’s Institute of Engineering & Technology, Moodbidri, Karnataka,
  • Shankarappa Kalgudi Department of Mechanical Engineering, Alva’s Institute of Engineering & Technology, Moodbidri, Karnataka,
  • Satyanarayan . Department of Mechanical Engineering, Alva’s Institute of Engineering & Technology, Moodbidri, Karnataka,

DOI:

https://doi.org/10.37628/ijmmp.v5i1.835

Keywords:

Copper plate, Etching, Surface roughness, Contact angle, Super hydrophobic surfaces

Abstract

In the present study, an attempt has been made to create superhydrophobicity on copper substrate by etching the surface at different parameters (current density and time). Etching time was varied from 30 to 240 minutes. Untreated copper surface exhibited contact angle of 91.4°. The best etched surface exhibited a maximum contact angle of 142.1° for a current density of 0.01A/cm2 and etching time of 60 minutes. The structure–property relationship of etched copper surface has been discussed by interpreting atomic force microscope results with contact angle.

References

Koushik N., Jameson Keisham, Avinash Poojary, Lathesh, Shankarappa Kalgudi, Pavithra G.P., Satyanarayan. Electrochemical Etching on Copper Surfaces to Achieve Superhydrophobicity. International Journal of Manufacturing and Materials Processing. 2019; 1(1): 27-31p.

Downloads

Published

2019-05-15

Issue

Vol. 5 No. 1 (2019)

Section

Articles